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Merak3030Z
X-Ray Dynamic Flat Panel Detector
Merak3030Z series is a high-performance large-size IGZO flat panel detector, which can efficiently capture subtle details and provide accurate image information while ensuring low energy consumption. In addition, it also has functions such as performance optimization processing, ded image processing, 10G network image transmission and redundant backup design, providing a more convenient and reliable image processing and transmission method. Due to its excellent imaging performance, Merak3030Z series is widely used in high-end medical imaging and other fields.
Product Features
A pixel size of 148μm
2048×2048 pixel matrix
Applications
- Mobile C-arm
- DSA
- Other specialized CBCT
Specfication
Transducers
Type
IGZO (TFT)
Pixel size
148µm
Pixel matrix
2048×2048
Effective area
303.1×303.1mm²
Scintillator
Csl
Energy Range
40kV～125kV
Function
Acquisition mode
Continuous/Synchronous Mode
Trig mode
Internal/external Trigger
ROI
Custom Size
Other
Interface
RJ45（Ethernet protocol interface,GigE10G）
Power supply
DC24V±10%
Consumption
≤20W
Usage environment
+10ºC~+40ºC
Storage environment
-20ºC~+55ºC
Product Comparison
Comparison
| Model | Type | Pixel size | Pixel matrix | Effective area | Rate | Scintillator | Irradiation lifetime | Energy Range | Acquisition mode | Trig mode | ROI | Interface | Power supply | Consumption | Usage environment | Storage environment | Weight | External dimensions(W×L×H) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Merak1313 | CMOS | 100μm | 1280×1280 | 128.0×128.0 mm² | CsI | 40kV～120kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak1412 | CMOS | 100μm | 1404×1204 | 140.4×120.4mm² | CsI | 40kV～120kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak1215A | CMOS | 49.5μm | 2940×2342 | 115.9×145.5 mm² | CsI | 20kV～90kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤6W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak1613S | a-Si (TFT) | 125μm | 1274×1024 | 159.3×128 mm² | CsI | 40kV～125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口，GigE 1G) | DC24V±10% | ≤12W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak1615 | CMOS | 100µm | 1600×1500 | 160×150mm² | CsI | 40kV～125kV | 连续触发/触发模式 | 内触发/外触发 | X×Y [X列数、Y行数，X、Y=2n，最小为16] | RJ45 (以太网协议接口，GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak1917Z | IGZO (TFT) | 120µm | 1536×1386 | 184.3×166.3mm² | CsI | 40kV～125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45（以太网协议接口，GigE 1G） | DC24V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak2121 | CMOS | 135µm | 1504×1560 | 203×211mm² | CsI | 40kV～125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45（以太网协议接口，GigE 1G） | DC(12V~24V)±10% | ≤15W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak3030 | CMOS | 100µm | 3240×3000 | 324×300mm² | CsI | 40kV～125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45（以太网协议接口，GigE 10G） | DC24V±10% | ≤25W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
| Merak3040 | CMOS | 100µm | 4320×3000 | 432×300mm² | CsI | 40kV～125kV | 连续模式/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45（以太网协议接口，GigE 10G） | DC24V±10% | ≤33W | +10ºC~+40ºC | -20ºC~+55ºC |